A multi-wave thermal process for treating a metal to improve structural characteristics is herein disclosed. The metal can be placed in a chamber. Each wave of the process can include: selecting a target temperature; selecting a temperature rate; and controlling the temperature rate while chilling the metal by introducing a cryogenic material into the chamber, while preventing over-stressing of the metal, to the target temperature at the temperature rate. While chilling the metal, the process can include inserting a hold time on the metal at an intermediate temperature for equalization of the temperature uniformly throughout the metal, thereby creating uniformity in a microcrystalline structure of the metal. The process can further include: stopping the introduction of the cryogenic material once the target temperature is reached and holding the metal at the target temperature. The process can result in a treated metal without fractures and with an organized microcrystalline structure.