Invention Grant
- Patent Title: Retaining ring with shaped profile
- Patent Title (中): 带有形状轮廓的保持环
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Application No.: US13269488Application Date: 2011-10-07
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Publication No.: US08388412B2Publication Date: 2013-03-05
- Inventor: Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
- Applicant: Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
Public/Granted literature
- US20120028548A1 RETAINING RING WITH SHAPED PROFILE Public/Granted day:2012-02-02
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