Invention Grant
US08388408B2 Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method 有权
用于选择用于抛光端点检测的光的波长的图的制作方法,用于选择用于抛光端点检测的光的波长的选择方法和抛光终点检测方法

  • Patent Title: Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method
  • Patent Title (中): 用于选择用于抛光端点检测的光的波长的图的制作方法,用于选择用于抛光端点检测的光的波长的选择方法和抛光终点检测方法
  • Application No.: US12461533
    Application Date: 2009-08-14
  • Publication No.: US08388408B2
    Publication Date: 2013-03-05
  • Inventor: Yoichi KobayashiNoburu ShimizuShinrou Ohta
  • Applicant: Yoichi KobayashiNoburu ShimizuShinrou Ohta
  • Applicant Address: JP Tokyo
  • Assignee: Ebara Corporation
  • Current Assignee: Ebara Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Wenderoth, Lind & Ponack, L.L.P.
  • Priority: JP2008-263375 20081010; JP2008-288704 20081111; JP2009-127254 20090527; JP2009-140079 20090611; JP2009-143052 20090616; JP2009-184271 20090807
  • Main IPC: B24B49/00
  • IPC: B24B49/00 B24B51/00
Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method
Abstract:
A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.
Information query
Patent Agency Ranking
0/0