A connector soldered to a PCB has an insulating housing of which two opposite ends are recessed to form a pair of holding recesses, terminals mounted in the insulating housing with soldering portions projected out of a bottom of the insulating housing, a pair of supporting members mounted to two opposite ends of the insulating housing and a pair of supporting members. A bottom of the supporting member extends perpendicularly to form an inserting slice having a portion thereof punched sideward to form a projection. The positioning member mounted to the inserting slice has a soldering tail and a base slice having two opposite ends thereof bent sideward and then extended toward each other to form a pair of clasping portions. A guiding slot is opened in the base portion for receiving the projection. The projection can move up and down in the guiding slot to adjust the position of the positioning member to keep the soldering portions and the soldering tails level even when there is tolerance in production.