Invention Grant
- Patent Title: Connector assembly with grounding shield
- Patent Title (中): 连接器组合带接地屏蔽
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Application No.: US13028468Application Date: 2011-02-16
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Publication No.: US08388370B2Publication Date: 2013-03-05
- Inventor: Takahiro Yamaji , Koji Hayashi , Takeshi Shindo
- Applicant: Takahiro Yamaji , Koji Hayashi , Takeshi Shindo
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2010-037856 20100223
- Main IPC: H01R12/24
- IPC: H01R12/24

Abstract:
A connector assembly comprises a first connector and a second connector configured to be mated with each other. The first connector includes a plurality of first contacts, a first housing and a first shell. The first contacts are arranged and retained in a pitch direction by the first housing The first housing is covered at least in part with the first shell The first shell includes a spring portion and a contact portion. The spring portion extends in the pitch direction. The spring portion is long in the pitch direction. The contact portion is supported by the spring portion so as to be movable in a direction perpendicular to the pitch direction. The second connector includes a second shell. The second shell is brought into contact with at least the contact portion of the first shell so that the first shell and the second shell are connected to each other when the second connector is mated with the first connector.
Public/Granted literature
- US20110207356A1 CONNECTOR ASSEMBLY Public/Granted day:2011-08-25
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