Invention Grant
- Patent Title: Method for detecting performances of heat dissipation modules
- Patent Title (中): 用于检测散热模块性能的方法
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Application No.: US12748809Application Date: 2010-03-29
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Publication No.: US08388221B2Publication Date: 2013-03-05
- Inventor: Feng-Ku Wang , Yi-Lun Cheng
- Applicant: Feng-Ku Wang , Yi-Lun Cheng
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW98140227A 20091125
- Main IPC: G01N25/00
- IPC: G01N25/00 ; G01K7/00

Abstract:
A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source.
Public/Granted literature
- US20110122914A1 METHOD FOR DETECTING PERFORMANCES OF HEAT DISSIPATION MODULES Public/Granted day:2011-05-26
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