Invention Grant
- Patent Title: Wafer container with purgeable supporting module
- Patent Title (中): 晶圆容器带可清洗支撑模块
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Application No.: US13183522Application Date: 2011-07-15
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Publication No.: US08387799B2Publication Date: 2013-03-05
- Inventor: Ming-Long Chiu , Kuo-Chun Hung , Chen-Wei Ku , Jain-Ping Sheng , Yi-Liang Hou
- Applicant: Ming-Long Chiu , Kuo-Chun Hung , Chen-Wei Ku , Jain-Ping Sheng , Yi-Liang Hou
- Applicant Address: TW New Taipei
- Assignee: Gudeng Precision Industrial Co, Ltd.
- Current Assignee: Gudeng Precision Industrial Co, Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: TW97132635A 20080827; TW100208340U 20110510
- Main IPC: B65D85/30
- IPC: B65D85/30 ; H01L21/673

Abstract:
A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.
Public/Granted literature
- US20110266193A1 Wafer Container With Purgeable Supporting Module Public/Granted day:2011-11-03
Information query
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