Invention Grant
- Patent Title: Method for filling bulk material
- Patent Title (中): 填充散装材料的方法
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Application No.: US12597067Application Date: 2008-03-12
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Publication No.: US08387779B2Publication Date: 2013-03-05
- Inventor: Detlev Schröder
- Applicant: Detlev Schröder
- Applicant Address: DE Essen
- Assignee: Thyssenkrupp Fördertechnik GmbH
- Current Assignee: Thyssenkrupp Fördertechnik GmbH
- Current Assignee Address: DE Essen
- Agency: McGlew and Tuttle, P.C.
- Priority: DE102007022388 20070510
- International Application: PCT/EP2008/001940 WO 20080312
- International Announcement: WO2008/138418 WO 20081120
- Main IPC: B65G37/00
- IPC: B65G37/00

Abstract:
A method for filling a terrain using bulk material, preferably excavating material from an ore mine. The method includes a) the terrain has at least three levels disposed parallel to each other; b) a conveyor system (1) by which the bulk material is conveyed is positioned on at least the level second from the bottom; c) a traveling tripper (2) can be displaced along the entire conveyor system (1), by which the bulk material on one or the other side of the conveyor system (1) can be transferred to a connecting conveyor bridge (3) that can also be displaced along the conveyor system (1); d) the connecting conveyor bridge (3) transfers the bulk material to a depositor (4) that can also be displaced along the conveyor system (1); e) the depositor (4) successively deposits the bulk material in elongated filling strips (A-G) on the various levels below and above the level (0) of the conveyor system (1); f) initially one or several levels below or above the level (0) are each filled with at least one strip (A-D or E-G) on one side of the conveyor system (1); and g) the traveling tripper (2), connecting conveyor bridge (3), and the depositor (4) are subsequently displaced to the other side of the conveyor system (1) in order to fill the corresponding filling strip at that location as well.
Public/Granted literature
- US20110203905A1 Method For Filling Bulk Material Public/Granted day:2011-08-25
Information query
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