Invention Grant
- Patent Title: Chip on wafer bonder
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Application No.: US12054097Application Date: 2008-03-24
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Publication No.: US08387674B2Publication Date: 2013-03-05
- Inventor: Chen-Hua Yu , Jui-Pin Hung , Weng-Jin Wu , Jean Wang , Wen-Chih Chiou
- Applicant: Chen-Hua Yu , Jui-Pin Hung , Weng-Jin Wu , Jean Wang , Wen-Chih Chiou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Comany, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Comany, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: B29C65/00
- IPC: B29C65/00
Abstract:
The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.
Public/Granted literature
- US20090142903A1 CHIP ON WAFER BONDER Public/Granted day:2009-06-04
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