Invention Grant
- Patent Title: Substrate processing system
- Patent Title (中): 基板加工系统
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Application No.: US12824025Application Date: 2010-06-25
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Publication No.: US08387556B2Publication Date: 2013-03-05
- Inventor: Tsutomu Sahoda , Futoshi Shimai , Akihiko Sato
- Applicant: Tsutomu Sahoda , Futoshi Shimai , Akihiko Sato
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2009-160042 20090706; JPP2010-140954 20100621
- Main IPC: B05C11/02
- IPC: B05C11/02 ; B05C5/00 ; B05B7/06

Abstract:
A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate.
Public/Granted literature
- US20110000428A1 Substrate processing system Public/Granted day:2011-01-06
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