Invention Grant
- Patent Title: System for assembling components on a circuit board
- Patent Title (中): 电路板组件组装系统
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Application No.: US12694293Application Date: 2010-01-27
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Publication No.: US08387233B2Publication Date: 2013-03-05
- Inventor: Jun-Min Yang , Hao-Chun Hsieh , Hsin-Lun Tsai , Chia-Hsien Lee
- Applicant: Jun-Min Yang , Hao-Chun Hsieh , Hsin-Lun Tsai , Chia-Hsien Lee
- Applicant Address: TW Xizhi Dist., New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Xizhi Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW98124854A 20090723
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04

Abstract:
A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.
Public/Granted literature
- US20110016708A1 METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD AND RELATED ASSEMBLING SYSTEM Public/Granted day:2011-01-27
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