Invention Grant
- Patent Title: Clad alloy substrates and method for making same
- Patent Title (中): 包覆合金基材及其制备方法
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Application No.: US10865060Application Date: 2004-06-10
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Publication No.: US08387228B2Publication Date: 2013-03-05
- Inventor: David S. Bergstrom , Kris J. Schott , Mark A. Tarhay
- Applicant: David S. Bergstrom , Kris J. Schott , Mark A. Tarhay
- Applicant Address: US OR Albany
- Assignee: ATI Properties, Inc.
- Current Assignee: ATI Properties, Inc.
- Current Assignee Address: US OR Albany
- Agency: K&L Gates LLP
- Agent Patrick J. Viccaro; John E. Grosselin, III
- Main IPC: B23P11/00
- IPC: B23P11/00 ; B32B15/01 ; B32B15/00

Abstract:
A method for producing a single-clad or multiple-clad product includes providing a welded assembly comprising a cladding material disposed on a substrate material. Both the substrate material and the cladding material are individually selected alloys. At least a first edge of the cladding material of the welded assembly does not extend to a first edge of the substrate material and thereby provides a margin between the first edges. A material that is an alloy having hot strength greater than the cladding material is within the margin and adjacent the first edge of the cladding material. The welded assembly is hot rolled to provide a hot rolled band, and the material within the margin inhibits the cladding material from spreading beyond the edge of the substrate material during the hot rolling. In certain embodiments of the methods, the substrate material is stainless steel and the cladding material is nickel or a nickel alloy.
Public/Granted literature
- US20050273994A1 Clad alloy substrates and method for making same Public/Granted day:2005-12-15
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