Invention Grant
- Patent Title: Temperature controlled attenuator
- Patent Title (中): 温度控制衰减器
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Application No.: US12978179Application Date: 2010-12-23
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Publication No.: US08386986B2Publication Date: 2013-02-26
- Inventor: Marcus Granger-Jones , Brad Nelson , Ed Franzwa
- Applicant: Marcus Granger-Jones , Brad Nelson , Ed Franzwa
- Applicant Address: US NC Greensboro
- Assignee: RF Micro Devices, Inc.
- Current Assignee: RF Micro Devices, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In one embodiment, a temperature controlled attenuator is disclosed having an attenuation circuit and a control circuit. The attenuation circuit includes a series connected attenuation circuit segment and a shunt connected attenuation circuit segment, as well as additional attenuation circuit segments. Each attenuation circuit segment includes a stack of transistors that are coupled to provide the attenuation circuit segment with a variable impedance level having a continuous impedance range. Furthermore, the temperature controlled attenuator includes a temperature controlled circuit that adjusts an attenuation level of the attenuation circuit in accordance to an operating temperature. In this manner, the attenuation level of the temperature controlled attenuator is temperature dependent.
Public/Granted literature
- US20110148503A1 TEMPERATURE CONTROLLED ATTENUATOR Public/Granted day:2011-06-23
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