Invention Grant
US08385142B1 Flexible data strobe signal bus structure for wirebond and flip-chip packaging
有权
灵活的数据选通信号总线结构，用于引线键合和倒装芯片封装
- Patent Title: Flexible data strobe signal bus structure for wirebond and flip-chip packaging
- Patent Title (中): 灵活的数据选通信号总线结构，用于引线键合和倒装芯片封装
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Application No.: US12464783Application Date: 2009-05-12
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Publication No.: US08385142B1Publication Date: 2013-02-26
- Inventor: Guu Lin , Yen-Fu Lin , Mark W. Fiester , Stephanie T. Tran
- Applicant: Guu Lin , Yen-Fu Lin , Mark W. Fiester , Stephanie T. Tran
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: G11C5/06
- IPC: G11C5/06
Abstract:
An integrated circuit with a flexible data strobe signal (DQS) bus structure is presented. The integrated circuit has a number of input/output (I/O) modules with a number of data pins to receive and transmit data. In addition, a subset of the I/O modules also have a data strobe pin. The input/output modules are connected to data strobe signal buses having a fixed configuration. The configuration of the fixed DQS bus groups a number of data pins with a corresponding data strobe pin and the grouping of data pin spans multiple I/O modules. The integrated circuit also has a flexible data bus connected to the I/O modules. Data pins of I/O modules of a second integrated circuit are mapped a subset of the data pins of corresponding I/O modules of the integrated circuit. The flexible data strobe signal bus enables selection of the subset of data pins in the integrated circuit.
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