Invention Grant
US08385057B2 Fully extendable dual-segmented housing assembly for mobile computing device
有权
用于移动计算设备的完全可扩展的双分段外壳组件
- Patent Title: Fully extendable dual-segmented housing assembly for mobile computing device
- Patent Title (中): 用于移动计算设备的完全可扩展的双分段外壳组件
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Application No.: US12796541Application Date: 2010-06-08
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Publication No.: US08385057B2Publication Date: 2013-02-26
- Inventor: Eric Liu , Peter Skillman
- Applicant: Eric Liu , Peter Skillman
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H05K1/00
Abstract:
A mobile computing device formed from at least two housing segments that can be moved between positions, including an open position that fully exposes a display surface or façade of each of the housing segments, and a closed position in which at least one of the facades or display surfaces is occluded or overlaid by the other housing segment, according to at least some embodiments.
Public/Granted literature
- US20110299235A1 FULLY EXTENDABLE DUAL-SEGMENTED HOUSING ASSEMBLY FOR MOBILE COMPUTING DEVICE Public/Granted day:2011-12-08
Information query
