Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US13037218Application Date: 2011-02-28
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Publication No.: US08385053B2Publication Date: 2013-02-26
- Inventor: Hideo Shirasaka , Tetsuhiko Fukazawa
- Applicant: Hideo Shirasaka , Tetsuhiko Fukazawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2010-090528 20100409
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
According to one embodiment, an electronic device includes a housing and a plurality of ribs. The housing houses at least part of an electronic component. The ribs are arranged along a flat side surface of the electronic component in the housing such that the inner surface of the ribs faces the side surface. The ribs comprises a rib that faces the side surface of the electronic component, and another rib that is located on an edge side of the side surface compared to the rib and more distant from the side surface than the rib.
Public/Granted literature
- US20110249379A1 ELECTRONIC DEVICE Public/Granted day:2011-10-13
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