Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US12211117Application Date: 2008-09-16
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Publication No.: US08384547B2Publication Date: 2013-02-26
- Inventor: Noboru Kato
- Applicant: Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-107839 20060410; JP2006-136243 20060516
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
A wireless IC device includes a wireless IC chip having a power supply circuit including a resonant circuit having a predetermined resonant frequency and a radiation plate that externally radiates a transmission signal supplied from the power supply circuit and that supplies a reception signal externally transmitted to the power supply circuit. The radiation plate is connected to the power supply circuit via an electric field or the radiation plate is coupled to the power supply circuit via a magnetic field. The radiation plate is a two-surface-open type radiation plate including at least one radiation portion arranged to externally exchange a transmission-reception signal and a power supply portion arranged to exchange a transmission-reception signal with the power supply circuit.
Public/Granted literature
- US20090002130A1 WIRELESS IC DEVICE Public/Granted day:2009-01-01
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