Invention Grant
- Patent Title: Integrated circuit and method for manufacturing same
- Patent Title (中): 集成电路及其制造方法
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Application No.: US12761812Application Date: 2010-04-16
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Publication No.: US08384429B2Publication Date: 2013-02-26
- Inventor: Berndt Gammel , Thomas Nirschl , Gerd Dirscherl , Philip Schlazer , Stefan Rueping
- Applicant: Berndt Gammel , Thomas Nirschl , Gerd Dirscherl , Philip Schlazer , Stefan Rueping
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dickstein Shapiro LLP
- Main IPC: H03K19/20
- IPC: H03K19/20
Abstract:
An integrated circuit has one or more logic gates and a control circuit. The control circuit has one or more control elements coupled to the logic gates. The control circuit controls the states of the one or more logic gates. The one or more control elements have one or more programmable resistance elements and/or one or more threshold switching elements.
Public/Granted literature
- US20110254589A1 INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-10-20
Information query
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