Invention Grant
US08384221B2 Semiconductor device, LED head and method of manufacturing the same
有权
半导体器件，LED头及其制造方法
- Patent Title: Semiconductor device, LED head and method of manufacturing the same
- Patent Title (中): 半导体器件，LED头及其制造方法
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Application No.: US12588642Application Date: 2009-10-22
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Publication No.: US08384221B2Publication Date: 2013-02-26
- Inventor: Takahito Suzuki , Hiroyuki Fujiwara
- Applicant: Takahito Suzuki , Hiroyuki Fujiwara
- Applicant Address: JP Tokyo
- Assignee: Oki Data Corporation
- Current Assignee: Oki Data Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2003-319423 20030911
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operating regions, and the element isolating region is etched to a shallower depth than a thickness of the semiconductor thin film, and is a thinner region than the plurality of discrete operating regions.
Public/Granted literature
- US20100065859A1 Semiconductor device and method of manufacturing the same Public/Granted day:2010-03-18
Information query
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