A wafer level molding structure including a first chip, a second chip and an adhesive layer therebetween is provided. The first chip includes a first back side, a first front side and a plurality of lateral sides, and a plurality of first front side bumps are disposed on the first front side. The second chip includes a second back side and a second front side, and a plurality of second back side bumps and second front side bumps are respectively disposed on the second back side and the second front side. A plurality of through electrodes are disposed in the second chip, and electrically connected the second back side bumps to the second front side bumps. Adhesive materials including a plurality of conductive particles cover the lateral sides, and electrically connect the second back side bumps with the first front side bumps.