Invention Grant
US08384167B2 Semiconductor device with field effect transistor and manufacturing method thereof
有权
具有场效应晶体管的半导体器件及其制造方法
- Patent Title: Semiconductor device with field effect transistor and manufacturing method thereof
- Patent Title (中): 具有场效应晶体管的半导体器件及其制造方法
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Application No.: US12858029Application Date: 2010-08-17
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Publication No.: US08384167B2Publication Date: 2013-02-26
- Inventor: Yoshiaki Kikuchi , Hitoshi Wakabayashi
- Applicant: Yoshiaki Kikuchi , Hitoshi Wakabayashi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-193353 20090824
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes: a semiconductor substrate in which a SiGe layer having a first width in a channel direction is embedded in a channel forming region; gate insulating film formed on the channel forming region; a gate electrode formed on the gate insulating film and having a region protruding from a forming region of the SiGe layer with a second width wider than the first width; and source/drain regions having extension regions formed on the semiconductor substrate which sandwiches the channel forming region, thereby forming a field effect transistor, wherein the extension region is apart from the SiGe layer so that a depletion layer extending from a junction surface between the extension region and the semiconductor substrate does not reach the SiGe layer.
Public/Granted literature
- US20110042758A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-02-24
Information query
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