Invention Grant
US08384116B2 Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display
有权
具有安装在其上的芯片的基板，其上安装有芯片的基板的制造方法，显示器和显示器的制造方法
- Patent Title: Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display
- Patent Title (中): 具有安装在其上的芯片的基板，其上安装有芯片的基板的制造方法，显示器和显示器的制造方法
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Application No.: US12622639Application Date: 2009-11-20
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Publication No.: US08384116B2Publication Date: 2013-02-26
- Inventor: Hiizu Ohtorii , Akiyoshi Aoyagi , Katsuhiro Tomoda
- Applicant: Hiizu Ohtorii , Akiyoshi Aoyagi , Katsuhiro Tomoda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-296512 20081120
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/48 ; H01L23/52 ; H01L23/40
Abstract:
Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern.
Public/Granted literature
Information query
IPC分类:
