Invention Grant
US08383983B2 Substrate cutting apparatus and method of cutting substrate using the same
有权
基板切割装置及使用其的基板的切割方法
- Patent Title: Substrate cutting apparatus and method of cutting substrate using the same
- Patent Title (中): 基板切割装置及使用其的基板的切割方法
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Application No.: US12731410Application Date: 2010-03-25
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Publication No.: US08383983B2Publication Date: 2013-02-26
- Inventor: Hyun-Chul Lee , Cheol-Lee Roh , Gyoo-Wan Han , Seung-Ho Myoung , Jong-Heon Kim , Joon-Hyung Kim , Sung-Gon Kim , Yong-Jin Lee
- Applicant: Hyun-Chul Lee , Cheol-Lee Roh , Gyoo-Wan Han , Seung-Ho Myoung , Jong-Heon Kim , Joon-Hyung Kim , Sung-Gon Kim , Yong-Jin Lee
- Applicant Address: KR Yongin, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0025451 20090325
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/16 ; B23K26/00
Abstract:
A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.
Public/Granted literature
- US20100243628A1 SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME Public/Granted day:2010-09-30
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