Invention Grant
US08383496B2 Plasma doping method and manufacturing method of semiconductor device 有权
等离子体掺杂方法及半导体器件的制造方法

  • Patent Title: Plasma doping method and manufacturing method of semiconductor device
  • Patent Title (中): 等离子体掺杂方法及半导体器件的制造方法
  • Application No.: US13054825
    Application Date: 2009-08-07
  • Publication No.: US08383496B2
    Publication Date: 2013-02-26
  • Inventor: Kazuhiko TonariTsutomu Nishihashi
  • Applicant: Kazuhiko TonariTsutomu Nishihashi
  • Agency: Cermak Nakajima LLP
  • Agent Tomoko Nakajima
  • Priority: JP2008-209283 20080815; JP2008-221107 20080829
  • International Application: PCT/JP2009/064047 WO 20090807
  • International Announcement: WO2010/018797 WO 20100218
  • Main IPC: H01L21/26
  • IPC: H01L21/26 H01L21/42
Plasma doping method and manufacturing method of semiconductor device
Abstract:
A plasma doping method capable of introducing impurities into an object to be processed uniformly is supplied. Plasma of a diborane gas containing boron, which is a p-type impurity, and an argon gas, which is a rare gas, is generated, and no bias potential is applied to a silicon substrate. Thereby, the boron radicals in the plasma are deposited on the surface of the silicon substrate. After that, the supply of the diborane gas is stopped, and bias potential is applied to the silicon substrate. Thereby, the argon ions in the plasma are radiated onto the surface of the silicon substrate. The radiated argon ions collide with the boron radicals, and thereby boron radicals are introduced into the silicon substrate. The introduced boron radicals are activated by thermal processing, and thereby a p-type impurity diffusion layer is formed in the silicon substrate.
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