Invention Grant
- Patent Title: Manufracturing method of solid-state imaging device
- Patent Title (中): 固态成像装置的制造方法
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Application No.: US13586345Application Date: 2012-08-15
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Publication No.: US08383446B2Publication Date: 2013-02-26
- Inventor: Chiaki Sakai
- Applicant: Chiaki Sakai
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JPP2009-037556 20090220
- Main IPC: H01L31/14
- IPC: H01L31/14
Abstract:
A solid-state imaging device includes: a photoelectric conversion portion that receives an incident light from a back surface side of a silicon layer to perform photoelectric conversion on the incident light; and a pixel transistor portion that outputs signal charges generated in the photoelectric conversion portion towards a front surface side of the silicon layer, wherein a gettering layer having internal stress is provided on the front surface side of the silicon layer at a position to overlap the photoelectric conversion portion on a plan view layout thereof.
Public/Granted literature
- US20120322193A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2012-12-20
Information query
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