Invention Grant
- Patent Title: Method of forming a film by deposition from a plasma
- Patent Title (中): 通过从等离子体沉积形成膜的方法
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Application No.: US12447615Application Date: 2007-10-26
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Publication No.: US08383210B2Publication Date: 2013-02-26
- Inventor: Pere Roca I Cabarrocas , Pavel Bulkin , Dmitri Daineka , Patrick Leempoel , Pierre Descamps , Thibault Kervyn De Meerendre
- Applicant: Pere Roca I Cabarrocas , Pavel Bulkin , Dmitri Daineka , Patrick Leempoel , Pierre Descamps , Thibault Kervyn De Meerendre
- Applicant Address: BE Seneffe FR Palaiseau
- Assignee: Dow Corning Europe S.A.,Ecole Polytechnique
- Current Assignee: Dow Corning Europe S.A.,Ecole Polytechnique
- Current Assignee Address: BE Seneffe FR Palaiseau
- Agency: Leason Ellis LLP
- Priority: EP06301118 20061102
- International Application: PCT/EP2007/009306 WO 20071026
- International Announcement: WO2008/052706 WO 20080508
- Main IPC: C23C16/511
- IPC: C23C16/511

Abstract:
A method is described of depositing film of an amorphous or microcrystalline material, for example silicon, from a plasma on to a substrate. Microwave energy is introduced into a chamber as a sequence of discrete microwave pulses, a film precursors gas is introduced into the chamber as a sequence of discrete gas pulses, and gas for generating atomic hydrogen is supplied to the chamber at least during each microwave pulse. Each microwave pulse is followed in non-overlapping fashion with a precursor gas pulse, and each precursor gas pulse is followed by a period during which there is neither a microwave pulse nor a precursor gas pulse.
Public/Granted literature
- US20100047473A1 METHOD OF FORMING A FILM BY DEPOSITION FROM A PLASMA Public/Granted day:2010-02-25
Information query
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