Invention Grant
- Patent Title: Probe array substrate and method for producing the same, and probe array and method for producing the same
- Patent Title (中): 探针阵列基板及其制造方法,探针阵列及其制造方法
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Application No.: US12779276Application Date: 2010-05-13
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Publication No.: US08383057B2Publication Date: 2013-02-26
- Inventor: Teruhisa Shibahara
- Applicant: Teruhisa Shibahara
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-fu
- Agency: Dickstein Shapiro LLP
- Priority: JP2007-302573 20071122
- Main IPC: G01N33/00
- IPC: G01N33/00

Abstract:
A probe array substrate suitable for forming a probe array that has high packing density, that can hold sufficient amounts of probe molecules, and that has little variation in the amounts of probe molecules. A plurality of arrayed probe-holding portions are defined by recesses, and isolating grooves are formed between the adjacent probe-holding portions to prevent probe solutions introduced into the probe-holding portions from spreading to adjacent probe-holding portions. Inner surfaces of the probe-holding portions are made hydrophilic, whereas inner surfaces of the isolating grooves are made hydrophobic. Liquid-introducing protrusions are formed in the probe-holding portions.
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