Invention Grant
- Patent Title: Method of bonding porous metal to metal substrates
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Application No.: US12575998Application Date: 2009-10-08
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Publication No.: US08383033B2Publication Date: 2013-02-26
- Inventor: Gautam Gupta
- Applicant: Gautam Gupta
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing Corp.
- Current Assignee: Biomet Manufacturing Corp.
- Current Assignee Address: US IN Warsaw
- Agency: Harness, Dickey
- Main IPC: B22F7/04
- IPC: B22F7/04

Abstract:
A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.
Public/Granted literature
- US20110085929A1 METHOD OF BONDING POROUS METAL TO METAL SUBSTRATES Public/Granted day:2011-04-14
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