Invention Grant
- Patent Title: Copper powder for conductive paste and conductive paste
- Patent Title (中): 铜粉用于导电膏和导电膏
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Application No.: US12861123Application Date: 2010-08-23
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Publication No.: US08383015B2Publication Date: 2013-02-26
- Inventor: Koyu Ota , Makoto Sekiguchi , Katsuhiko Yoshimaru
- Applicant: Koyu Ota , Makoto Sekiguchi , Katsuhiko Yoshimaru
- Applicant Address: JP Tokyo
- Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/22
Abstract:
Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.
Public/Granted literature
- US20110095239A1 COPPER POWDER FOR CONDUCTIVE PASTE AND CONDUCTIVE PASTE Public/Granted day:2011-04-28
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