Invention Grant
- Patent Title: Thermally conductive silicone grease composition
- Patent Title (中): 导热硅油组合物
-
Application No.: US13282797Application Date: 2011-10-27
-
Publication No.: US08383005B2Publication Date: 2013-02-26
- Inventor: Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
- Applicant: Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-253762 20101112
- Main IPC: C09K5/10
- IPC: C09K5/10 ; C08G77/04 ; C08G77/12 ; C08G77/20

Abstract:
A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
Public/Granted literature
- US20120119137A1 THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION Public/Granted day:2012-05-17
Information query