Invention Grant
- Patent Title: Plasma processing chamber with enhanced gas delivery
- Patent Title (中): 等离子处理室具有增强的气体输送
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Application No.: US12501885Application Date: 2009-07-13
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Publication No.: US08382939B2Publication Date: 2013-02-26
- Inventor: Michael Charles Kutney , Roger Alan Lindley
- Applicant: Michael Charles Kutney , Roger Alan Lindley
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23F1/00 ; H01L21/306 ; C23C16/06 ; C23C16/22 ; C23C16/50 ; C23C16/503 ; C23C16/505 ; C23C16/509
Abstract:
A method and apparatus for providing flow into a processing chamber are provided. In one embodiment, a vacuum processing chamber is provided that includes a substrate support pedestal disposed in an interior volume of a chamber body, a lid enclosing the interior volume, a gas distribution plate positioned below the lid and above the substrate support pedestal, and a vortex inducing gas inlet oriented to induce a vortex of gas circulating in a plenum around a center line of the chamber body prior to the gas passing through the gas distribution plate.
Public/Granted literature
- US20110006038A1 PLASMA PROCESSING CHAMBER WITH ENHANCED GAS DELIVERY Public/Granted day:2011-01-13
Information query
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