Invention Grant
- Patent Title: Modular cable clamp with high impedance surface
- Patent Title (中): 具有高阻抗表面的模块化电缆夹
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Application No.: US13495399Application Date: 2012-06-13
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Publication No.: US08382523B1Publication Date: 2013-02-26
- Inventor: Luis J. Lazaro, Jr.
- Applicant: Luis J. Lazaro, Jr.
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Caven & Aghevli LLC
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A cable terminating and grounding apparatus and method comprises a backshell including a cable terminating and grounding adapter shield which comprises a cable receiving and positioning portion comprising a plurality of individual cable passages around the outer rim of the receiving and positioning portion and a gathering portion adjacent the receiving and positioning portion comprising a plurality of individual cable receiving slots around an outer periphery of the gathering portion, each slot having a side wall receiving a cable shield enclosing one or more wires comprising the cable. A gathering mechanism may engage each of the cable shields oppositely from the respective slot side wall and force the respective shield into engagement with the respective slot side wall. There may be a cable passage in a center portion of the receiving and positioning portion and the gathering portion. A locking portion of the adapter shield may engage a connector.
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