Invention Grant
- Patent Title: Liquid ejection device
- Patent Title (中): 液体喷射装置
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Application No.: US13023004Application Date: 2011-02-08
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Publication No.: US08382236B2Publication Date: 2013-02-26
- Inventor: Jun Shimazaki
- Applicant: Jun Shimazaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-029849 20100215
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejection device includes a liquid ejection head and a capping mechanism. The liquid ejection head includes nozzles for ejecting a liquid. The capping mechanism covers the nozzles and receiving the liquid, the capping mechanism being selectively disposed in a contacting state in which the capping mechanism contacts with a nozzle formation surface of the liquid ejection head or in a separated state in which the capping mechanism is separated from the nozzle formation surface. The capping mechanism includes a cap member forming a space in which openings of the nozzles are hermetically sealed in the contacting state, and a pressurizing unit configured to increase pressure in an inner space surrounded by the nozzle formation surface and an inner surface of the cap member.
Public/Granted literature
- US20110199422A1 LIQUID EJECTION DEVICE Public/Granted day:2011-08-18
Information query
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