A print head having high printing reliability, in which temperature unevenness is suppressed even when printing is performed using a print head having an increased length and density of an ejection opening array, can be provided. Specifically, a temperature equalizing member such as a heat pipe and a cooling liquid passage is disposed between a first support substrate and each of second support substrates or is disposed inside the first support substrate. This makes it possible to equalize temperature among the plurality of second support substrates and further equalize temperature among the printing element substrates bonded to these support substrates. In addition, the temperature equalizing member is made close to the printing element substrate, thus making it possible to efficiently equalize temperature.