Invention Grant
- Patent Title: Dual hopper assembly
- Patent Title (中): 双料斗组合
-
Application No.: US13496399Application Date: 2010-09-17
-
Publication No.: US08382092B2Publication Date: 2013-02-26
- Inventor: James R. Meier , Jeff Stangler , Chad Johnson
- Applicant: James R. Meier , Jeff Stangler , Chad Johnson
- Applicant Address: US CA Irvine
- Assignee: HID Global Corporation
- Current Assignee: HID Global Corporation
- Current Assignee Address: US CA Irvine
- Agency: Westman, Champlin & Kelly, P.A.
- International Application: PCT/US2010/049304 WO 20100917
- International Announcement: WO2011/035138 WO 20110324
- Main IPC: B65H5/22
- IPC: B65H5/22 ; B65H83/00 ; B65H85/00

Abstract:
Embodiments of the invention are directed to a dual hopper assembly for use in a credential processing device, a credential processing device that includes a dual hopper assembly, and methods of feeding substrates in a credential processing. One embodiment of the dual hopper assembly comprises an upper hopper configured to support one or more card substrates, a lower hopper configured to support one or more card substrates and an input feed roller. The input feed roller is positioned between the upper and lower hoppers and is movable between a first position, in which the input feed roller engages a bottom substrate supported in the upper hopper, and a second position, in which the input feed roller is displaced from the bottom substrate.
Public/Granted literature
- US20120175836A1 DUAL HOPPER ASSEMBLY Public/Granted day:2012-07-12
Information query