Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12532190Application Date: 2008-03-28
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Publication No.: US08382088B2Publication Date: 2013-02-26
- Inventor: Keisuke Kondoh
- Applicant: Keisuke Kondoh
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Ipusa, PLLC
- Priority: JP2007-095376 20070330
- International Application: PCT/JP2008/056082 WO 20080328
- International Announcement: WO2008/120716 WO 20081009
- Main IPC: B25B1/22
- IPC: B25B1/22

Abstract:
A substrate processing apparatus is disclosed for bringing a substrate from a carrier, by a substrate transfer portion inside a transfer chamber, into a processing module to perform a process therein. The substrate processing apparatus includes a substrate storing chamber coupled to an exterior of the transfer chamber via a transfer opening to be in communications with the transfer chamber; a first storing shelf in the substrate storing chamber to store substrates for a first storing purpose; a second storing shelf in the substrate storing chamber to store substrates for a second storing purpose different from the first storing purpose; and a shifting mechanism that shifts the first and the second storing shelves to position a substrate storing area of one of the first and the second storing shelves so that substrate transferring is enabled between the substrate storing area and the substrate transfer portion via the transfer opening.
Public/Granted literature
- US20100102030A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER READABLE STORAGE MEDIUM Public/Granted day:2010-04-29
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