Invention Grant
- Patent Title: Method for recovering silicon from sawing waste
- Patent Title (中): 从锯切废物回收硅的方法
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Application No.: US12808777Application Date: 2008-12-04
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Publication No.: US08381914B2Publication Date: 2013-02-26
- Inventor: Patrik Hoffmann
- Applicant: Patrik Hoffmann
- Applicant Address: CH Lausanne
- Assignee: Ecole Polytechnique Federale de Lausanne (EPFL)
- Current Assignee: Ecole Polytechnique Federale de Lausanne (EPFL)
- Current Assignee Address: CH Lausanne
- Agency: Young & Thompson
- Priority: CH1965/07 20071219
- International Application: PCT/IB2008/003330 WO 20081204
- International Announcement: WO2009/081245 WO 20090702
- Main IPC: B03D1/02
- IPC: B03D1/02

Abstract:
A method for separating and recovering silicon debris from sawing waste is characterized in that it includes the following steps: —treating the sawing waste so as to deoxidize the silicon debris in a manner that reduces their surface energy, —applying to the sawing waste thus treated a flotation method using a flotation liquid and a nonoxidizing flotation gas, and —recovering the silicon debris at the surface of the flotation liquid.
Public/Granted literature
- US20100278707A1 METHOD FOR RECOVERING SILICON FROM SAWING WASTE Public/Granted day:2010-11-04
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