Invention Grant
- Patent Title: Method of manufacturing a boundary acoustic wave device
- Patent Title (中): 声界面波装置的制造方法
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Application No.: US12342296Application Date: 2008-12-23
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Publication No.: US08381386B2Publication Date: 2013-02-26
- Inventor: Hajime Kando
- Applicant: Hajime Kando
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2004-010661 20040119; JP2004-259399 20040907
- Main IPC: H04R31/00
- IPC: H04R31/00

Abstract:
A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.
Public/Granted literature
- US20090102318A1 BOUNDARY ACOUSTIC WAVE DEVICE Public/Granted day:2009-04-23
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