Invention Grant
US08369978B2 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
有权
通过在加工过程中使用基板的光谱监测来调整抛光速率
- Patent Title: Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
- Patent Title (中): 通过在加工过程中使用基板的光谱监测来调整抛光速率
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Application No.: US12553870Application Date: 2009-09-03
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Publication No.: US08369978B2Publication Date: 2013-02-05
- Inventor: Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
- Applicant: Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials
- Current Assignee: Applied Materials
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B24B49/00 ; H01L21/00 ; H01L21/302 ; G01N21/00 ; G01B11/28 ; G01B11/02
Abstract:
A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
Public/Granted literature
- US20100056023A1 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing Public/Granted day:2010-03-04
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