Invention Grant
US08369702B2 Electronic devices with component mounting structures 有权
具有组件安装结构的电子设备

  • Patent Title: Electronic devices with component mounting structures
  • Patent Title (中): 具有组件安装结构的电子设备
  • Application No.: US12835695
    Application Date: 2010-07-13
  • Publication No.: US08369702B2
    Publication Date: 2013-02-05
  • Inventor: Emery Sanford
  • Applicant: Emery Sanford
  • Applicant Address: US CA Cupertino
  • Assignee: Apple Inc.
  • Current Assignee: Apple Inc.
  • Current Assignee Address: US CA Cupertino
  • Agency: Treyz Law Group
  • Agent G. Victor Treyz; David C. Kellogg
  • Main IPC: G03B17/02
  • IPC: G03B17/02
Electronic devices with component mounting structures
Abstract:
Electronic devices are provided that have components. Outer and inner component mounting members may engage each other with threads. Openings in the outer and inner members may be configured to engage component sidewalls and alignment tools.
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