Invention Grant
- Patent Title: PCI-E module
- Patent Title (中): PCI-E模块
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Application No.: US12848296Application Date: 2010-08-02
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Publication No.: US08369101B2Publication Date: 2013-02-05
- Inventor: Yi-Fang Chuang
- Applicant: Yi-Fang Chuang
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A PCI-E module includes a circuit board, an insulated housing and a plurality of connection terminals. Each connection terminal has a connection end and a welding end away from the connection end. The connection terminals are alternately and parallelly arranged in the housing to form a structure of the PCI-E module. The circuit board has a plurality of gold fingers on both sides of one end thereof, and each connection end of the connection terminals is electronically connected to the gold fingers. Each welding end of the connection terminals is bent down through and extends out of the housing. Therefore, the PCI-E module can be welded directly on a main board of a computer through the welding ends of the connection terminals.
Public/Granted literature
- US20120026709A1 PCI-E MODULE Public/Granted day:2012-02-02
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