Invention Grant
- Patent Title: Lamellar stacked solid electrolytic capacitor
- Patent Title (中): 层状固体电解电容器
-
Application No.: US12713398Application Date: 2010-02-26
-
Publication No.: US08369066B2Publication Date: 2013-02-05
- Inventor: Ching-Feng Lin , Yui-Hsin Fran , Chi-Hao Chiu , Ming-Tsung Chen , Cheng-Wei Lai , Chun-Chia Huang
- Applicant: Ching-Feng Lin , Yui-Hsin Fran , Chi-Hao Chiu , Ming-Tsung Chen , Cheng-Wei Lai , Chun-Chia Huang
- Applicant Address: TW Miaoli County
- Assignee: Apaq Technology Co., Ltd.
- Current Assignee: Apaq Technology Co., Ltd.
- Current Assignee Address: TW Miaoli County
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Priority: TW98123413A 20090710
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.
Public/Granted literature
- US20110007452A1 Lamellar Stacked Solid Electrolytic Capacitor Public/Granted day:2011-01-13
Information query