Invention Grant
- Patent Title: Clipping geometries in ray-casting
- Patent Title (中): 在射线铸造中剪切几何
-
Application No.: US12120329Application Date: 2008-05-14
-
Publication No.: US08368692B2Publication Date: 2013-02-05
- Inventor: Wei Li
- Applicant: Wei Li
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Main IPC: G06T15/40
- IPC: G06T15/40

Abstract:
A computer implemented method for creating a depth range buffer for supporting clipping geometries for ray-casting includes inputting image data, establishing a depth range buffer for specifying a start and an end point of each ray, computing a near depth of the image data corresponding to the start point of each ray, computing a far depth of the image data corresponding to the end point of each ray, clipping the volume by restricting ray-casting within the start and end points of the depth range buffer, and rendering a portion of the image data corresponding to the visible depth range.
Public/Granted literature
- US20090102842A1 CLIPPING GEOMETRIES IN RAY-CASTING Public/Granted day:2009-04-23
Information query