Invention Grant
- Patent Title: Thin-film bulk acoustic resonators having multi-axis acoustic wave propagation therein
- Patent Title (中): 具有多轴声波传播的薄膜体声共振器
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Application No.: US12713940Application Date: 2010-02-26
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Publication No.: US08368487B1Publication Date: 2013-02-05
- Inventor: Logan D. Sorenson
- Applicant: Logan D. Sorenson
- Applicant Address: US CA San Jose
- Assignee: Integrated Device Technology, Inc.
- Current Assignee: Integrated Device Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Myers Bigel, et al.
- Main IPC: H03H9/15
- IPC: H03H9/15 ; H03H9/13 ; H03H9/54

Abstract:
Microelectromechanical resonators include a resonator body anchored to a surrounding substrate by at least one support that holds the resonator body opposite a recess in the substrate. The resonator body has first and second pluralities of interdigitated drive and sense electrodes thereon. The first plurality of interdigitated drive and second electrodes are aligned to a first axis of acoustic wave propagation in the resonator body when the resonator body is operating at resonance. In contrast, the second plurality of interdigitated drive and sense electrodes are aligned to a second axis of acoustic wave propagation in the resonator body. This second axis of acoustic wave propagation preferably extends at an angle in a range from 60° to 120° relative to the first axis and, more preferably, at an angle of 90° relative to the first axis. The resonator body may also be configured to have a first side that is oriented at a 45° angle relative to the first axis of acoustic wave propagation and oriented at a 45° angle relative to the second axis of acoustic wave propagation.
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