Invention Grant
- Patent Title: Multiband matching circuit and multiband power amplifier
- Patent Title (中): 多频带匹配电路和多频带功率放大器
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Application No.: US12693809Application Date: 2010-01-26
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Publication No.: US08368483B2Publication Date: 2013-02-05
- Inventor: Atsushi Fukuda , Hiroshi Okazaki , Shoichi Narahashi
- Applicant: Atsushi Fukuda , Hiroshi Okazaki , Shoichi Narahashi
- Applicant Address: JP Tokyo
- Assignee: NTT DoCoMo, Inc.
- Current Assignee: NTT DoCoMo, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-020577 20090130; JP2009-295446 20091225
- Main IPC: H03H7/38
- IPC: H03H7/38

Abstract:
A multiband matching circuit includes a first matching unit, a second matching unit, and a third matching unit, with all units being connected in series in a signal path. Matching with target impedance is established at a first frequency by appropriately designing the first matching unit and at a second frequency by appropriately designing the second and third matching units. The second matching unit and the third matching unit are designed to make the conversion ratio of the impedance viewed from the connection point between the second matching unit and the third matching unit to a circuit element to the target impedance smaller than the conversion ratio of the impedance viewed from the connection point between the first matching unit and the second matching unit to the circuit element to the target impedance, at the second frequency.
Public/Granted literature
- US20100194491A1 MULTIBAND MATCHING CIRCUIT AND MULTIBAND POWER AMPLIFIER Public/Granted day:2010-08-05
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