A semiconductor body (1) comprises a first contact pad (2), a second contact pad (3), an integrated circuit (5) and an impedance (4). The integrated circuit (5) comprises a first terminal (6) which is coupled to the first contact pad (2) and a second terminal (7) which is coupled to the second contact pad (3). The impedance (4) additionally couples the first contact pad (2) to the second contact pad (3).