知搜-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US08368188B2 Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof 有权
作为用于集成电路封装系统的封装的脱模合格材料及其制造方法

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof
Abstract:
A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect.
Abstract(Chinese):

一种用于制造集成电路封装系统的方法，包括：提供集成电路; 在集成电路的外围安装引线; 通过互连将集成电路连接到引线; 以及通过在集成电路，引线和互连上按压适形材料来形成适形材料。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0