Invention Grant
- Patent Title: Nitride semiconductor device
- Patent Title (中): 氮化物半导体器件
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Application No.: US11263036Application Date: 2005-11-01
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Publication No.: US08368183B2Publication Date: 2013-02-05
- Inventor: Eiji Yamada , Takeshi Kamikawa , Masahiro Araki
- Applicant: Eiji Yamada , Takeshi Kamikawa , Masahiro Araki
- Applicant Address: JP Osaka-Shi
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-Shi
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2004-319183 20041102; JP2004-322339 20041105; JP2005-254510 20050902
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
A nitride semiconductor device is provided that prevents development of cracks, that has nitride semiconductor thin films with uniform thicknesses and good growth surface flatness, and is thus consistent in characteristics, and that can be fabricated at a satisfactory yield. In this nitride semiconductor device, the nitride semiconductor thin films are grown on a substrate having an off-angle between a direction normal to the surface of ridges and the crystal direction . This helps either reduce or intentionally promote diffusion or movement of the atoms or molecules of a source material of the nitride semiconductor thin films through migration thereof. As a result, a nitride semiconductor growth layer with good surface flatness can be formed, and thus a nitride semiconductor device with satisfactory characteristics can be obtained.
Public/Granted literature
- US20060094244A1 Nitride semiconductor device and fabrication method thereof Public/Granted day:2006-05-04
Information query
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