Invention Grant
US08368163B2 Semiconductor component with contacts made of alloyed-in metal wires
有权
具有由合金金属线制成的触点的半导体元件
- Patent Title: Semiconductor component with contacts made of alloyed-in metal wires
- Patent Title (中): 具有由合金金属线制成的触点的半导体元件
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Application No.: US12566981Application Date: 2009-09-25
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Publication No.: US08368163B2Publication Date: 2013-02-05
- Inventor: Andreas Krause , Martin Kutzer , Michael Heemeier , Alexander Fülle , Holger Neuhaus
- Applicant: Andreas Krause , Martin Kutzer , Michael Heemeier , Alexander Fülle , Holger Neuhaus
- Applicant Address: DE Freiberg
- Assignee: SolarWorld Innovations GmbH
- Current Assignee: SolarWorld Innovations GmbH
- Current Assignee Address: DE Freiberg
- Agency: McGlew and Tuttle, P.C.
- Priority: DE102008049220 20080927
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.
Public/Granted literature
- US20100078073A1 SEMICONDUCTOR COMPONENT WITH CONTACTS MADE OF ALLOYED-IN METAL WIRES Public/Granted day:2010-04-01
Information query
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