Invention Grant
- Patent Title: Light emitting element housing package
- Patent Title (中): 发光元件外壳包装
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Application No.: US13137930Application Date: 2011-09-21
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Publication No.: US08368108B2Publication Date: 2013-02-05
- Inventor: Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
- Applicant: Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
- Applicant Address: JP Aichi-ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi-ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-217351 20100928
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.
Public/Granted literature
- US20120074445A1 Light emitting element housing package Public/Granted day:2012-03-29
Information query
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